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HUGE 2-DAY EVENT, DAY #2 - FORMER ASSETS OF HEI INC. - MULTI-MILLION DOLLAR LATE MODEL SMT/LED COMPONENT PACKAGE & ASSEMBLY EQUIPMENT – COMPLETE PRODUCTION LINE

About HEI: The Microelectronic Assembly Operation Offers High Density, Direct Chip Attach Miniaturization Solutions, Including Services From Front End Development Through Full Production; Flex, Rigid-Flex And Ceramic Substrates, Which Are Used As Platforms For Microelectronic Assembly; Engineering Services For Creative Technological Solutions; Lean Flow Manufacturing; The Ability To Develop And Implement A Range Of Test Software And Hardware Solutions.

Assets To Include:  Over $1,500,000 In Inventory & Customer Lists Available • Kulicke & Soffa ICONN Wire BonderDatacon APM Die Bonders • Ekra X4 & X5 Screen Printers • Disco DAD3350 Dicing Saw • MyData My Series Chip Placement Systems • YES Plasma Etchers • Reflow Ovens • Temperature & Humidity Chambers • Epoxy Dispense Systems • Wafer Grinders & Polishers • Test & Measurement Equipment • Lab Support • Large Quantity Of High End Microscopes • Quality Assurance • Spare Parts • & Much, Much More

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